Selection of Semiconductor Packaging Materials by Combined Fuzzy AHP-Entropy and Proximity Index Value Method

The residue of no-clean flux (NCF) on the printed circuit board assembly has been one major reasons for corrosion reliability failure electronic devices. source aggressive contamination is carboxylic acid activator as main cleaning agent soldering surfaces. Selecting suitable always concerns due to its conflicting properties, example, suberic a lower boiling point that will help in minimizing residue; however, dissociation constant low which increase residue. selection based criteria multicriteria decision-making (MCDM) problem. In this study, thirty-one acids (mono, di, tri, and hydroxyl) were ranked six different criteria, i.e., melting point, molecular weight, (pKaa value), solubility, number using combined fuzzy AHP-entropy proximity index value method. Weight criterion was calculated AHP-entropy; whereas, ranking alternative done by First, overall acid; consequently, groupwise also evaluated. As result margaric occupied rank 1 out all monocarboxylic acids; malonic acquired lowest rank. addition, 9 dicarboxylic acids, sebacic most alternative. case tricarboxylic trimesic Sensitivity analysis performed verify consistency obtained through applied MCDM.